JPS62201932U - - Google Patents
Info
- Publication number
- JPS62201932U JPS62201932U JP9078586U JP9078586U JPS62201932U JP S62201932 U JPS62201932 U JP S62201932U JP 9078586 U JP9078586 U JP 9078586U JP 9078586 U JP9078586 U JP 9078586U JP S62201932 U JPS62201932 U JP S62201932U
- Authority
- JP
- Japan
- Prior art keywords
- pin
- heater section
- treatment apparatus
- heat treatment
- mounting means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090785U JPH0521875Y2 (en]) | 1986-06-14 | 1986-06-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986090785U JPH0521875Y2 (en]) | 1986-06-14 | 1986-06-14 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62201932U true JPS62201932U (en]) | 1987-12-23 |
| JPH0521875Y2 JPH0521875Y2 (en]) | 1993-06-04 |
Family
ID=30950968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986090785U Expired - Lifetime JPH0521875Y2 (en]) | 1986-06-14 | 1986-06-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0521875Y2 (en]) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS5749248A (en) * | 1980-09-09 | 1982-03-23 | Fujitsu Ltd | Substrate heating and retaining device |
| JPS6176957U (en]) * | 1984-10-26 | 1986-05-23 |
-
1986
- 1986-06-14 JP JP1986090785U patent/JPH0521875Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5737848A (en) * | 1980-08-19 | 1982-03-02 | Toshiba Corp | Heating apparatus for wafer |
| JPS5749248A (en) * | 1980-09-09 | 1982-03-23 | Fujitsu Ltd | Substrate heating and retaining device |
| JPS6176957U (en]) * | 1984-10-26 | 1986-05-23 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0521875Y2 (en]) | 1993-06-04 |